IEC 60191-6-2:2001/COR1:2002
Current
Current
The latest, up-to-date edition.
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Amendment of
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English
Published date
18-10-2002
Publisher
| Committee |
TC 47/SC 47D
|
| DocumentType |
Corrigendum
|
| Pages |
0
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
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