Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

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Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

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English, English - French, Spanish, Castilian

Published date

27-08-2001

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Tables

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Committee	TC 47/SC 47D
DevelopmentNote	Also numbered as BS EN 60191-6-8 (11/2001) A Bilingual edition has been published. (01/2013) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	10
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN EN IEC 60191-6-8 : 2001	Identical
UNE-EN 60191-6-8:2002	Identical
PN EN 60191-6-8 : 2002	Identical
NF EN 60191-6-8 : 2002	Identical
DIN EN 60191-6-8:2002-05	Identical
I.S. EN 60191-6-8:2002	Identical
CEI EN 60191-6-8 : 2002	Identical
EN 60191-6-8:2001	Identical

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IEC 60191-6-8:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

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Abstract

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