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IEC 60249-2-19:1992

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

23-07-2013

Superseded by

IEC 61249-2-19:2001

Published date

31-03-1992

€83.17
Excluding VAT

FOREWORD
Clause
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
   after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing

Gives requirements for properties of thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0.031 in).

DevelopmentNote
Also numbered as BS EN 60249-2.19. (09/2005)
DocumentType
Standard
Pages
35
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

IEC 60249-3A:1976 First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

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