IEC 60249-3-1:1981
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Hardcopy , PDF
English - French
01-01-1981
23-07-2013
FOREWORD
PREFACE
Clause
1 Scope
2 Designations
3 Materials and construction
3.1 General
3.2 Woven glass fabric
4 Bonding sheet material
4.1 Thickness, after laminating
4.2 Appearance
4.3 Properties of the bonding sheet material
4.4 Packaging and marking
4.5 Additional requirements for bonding sheet
material when supplied in rolls
5 Methods of test for bonding sheet material
5.1 Resin content
5.2 Resin flow
5.3 Volatile content
5.4 Gel time
5.5 Thickness
FIGURE
Covers the bonding sheet material used in the fabrication of multilayer printed boards. The test methods for bonding sheet material are also dealt with.
| DevelopmentNote |
Also numbered as BS 4584-103.1(1990) (08/2005)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NFC 93 750 : 1984 | Identical |
| BS 2782-7:Method 721A:1988 | Similar to |
| NFC 93 741 : 1996 | Identical |
| NEN 10249-3-1 : 1982 | Identical |
| DIN IEC 60249-3-1:1986-10 | Identical |
This standard has been withdrawn and is no longer current. No replacement edition is available.
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