• IEC 60317-2:2019

    Current The latest, up-to-date edition.

    Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  08-08-2019

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60317-2:2019 is available as IEC 60317-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

    IEC 60317-2:2019 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
    – Grade 1B: 0,020 mm up to and including 2,000 mm;
    – Grade 2B: 0,020 mm up to and including 2,000 mm.
    The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This fifth edition cancels and replaces the fourth edition published in 2012. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
    a) addition of heat bonding test loads for nominal conductor diameters up to and including 0,050 mm;
    b) addition of pin hole test requirements according to IEC 60317-0-1:2013.
    Keywords: insulated wires used for windings

    General Product Information - (Show below) - (Hide below)

    Committee TC 55
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes
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