IEC 60317-55:2013+AMD1:2019 CSV

IEC 60317-55:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is as follows:
- Grade 1: 0,020 mm up to and including 1,600 mm;
- Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- revision to Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating
This consolidated version consists of the second edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
This publication is to be read in conjunction with IEC 60317-0-1:2013.