IEC 60352-7:2020 RLV
Current
The latest, up-to-date edition.
Solderless connections - Part 7: Spring clamp connections - General requirements, test methods and practical guidance
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
16-12-2020
IEC 60352-7:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 60352-7:2020 is applicable to spring clamp connections made with stripped wire without further preparation:
- solid conductors of 0,32 mm to 3,7 mm nominal diameter (0,08 mm2 to 10 mm2 cross‑section), or
- stranded conductors of 0,08 mm2 to 10 mm2 cross-section, or
- flexible conductors of 0,08 mm2 to 10 mm2 cross-section,
according to IEC 60228 or IEC 60189-3 for use in electrical and electronic equipment and components.
Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this document is to determine the suitability of spring clamp connections under specified mechanical, electrical and atmospheric conditions. This second edition cancels and replaces the first edition of IEC 60352-7, published in 2002. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) correction of the two flow charts in Figure 6 and Figure 7,
b) split the content into more clauses for better separation between full test schedule and basic test schedule,
c) relocating the content of former Clause 6 Practical guidance into an informative Annex A, as now common in the IEC 60352 series for solderless connections,
d) clarification on conductor types with reference to classes defined in IEC 60228.
Committee |
TC 48/SC 48B
|
DocumentType |
Redline
|
ISBN |
978-2-8322-9214-3
|
Pages |
66
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
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