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IEC 60352-8:2011

Current

Current

The latest, up-to-date edition.

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English, English - French

Published date

10-02-2011

€155.95
Excluding VAT

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Tests
6 Practical guidance
Bibliography

IEC 60352-8:2011 Is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.

Committee
TC 48/SC 48B
DevelopmentNote
Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
46
PublisherName
International Electrotechnical Committee
Status
Current

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