• IEC 60664-3:2016 RLV

    Current The latest, up-to-date edition.

    Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  04-11-2016

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Design requirements
    5 Tests
    Annex A (normative) - Test sequences
    Annex B (normative) - Decisions to be taken by
            the technical committees
    Annex C (normative) - Printed wiring board for
            testing coatings
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60664-3:2016 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
    IEC 60664-3:2016 applies to assemblies protected against pollution by the use of coating, potting or moulding, thus allowing a reduction of clearance and creepage distances as described in IEC 60664-1. This document describes the requirements and test procedures for two methods of protection:
    - type 1 protection improves the microenvironment of the parts under the protection;
    - type 2 protection is considered to be similar to solid insulation. This edition includes the following significant technical changes with respect to the previous edition:
    a) information added concerning interpolation;
    b) provided scratch test is only for type 2 protection;
    c) renumbered the scratch test to follow the visual examination test, since it makes more sense there;
    d) separated the tables under what is now called Annex A, to make them clearer.

    General Product Information - (Show below) - (Hide below)

    Committee TC 109
    Development Note Stability Date: 2021. (11/2016)
    Document Type Redline
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60454-3-1:1998+AMD1:2001 CSV Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
    ISO/IEC Guide 51:2014 Safety aspects Guidelines for their inclusion in standards
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC GUIDE 104:2010 The preparation of safety publications and the use of basic safety publications and group safety publications
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60664-1:2007 Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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