IEC 60664-5:2003

Specifies the dimensioning of clearances and creepage distances for spacings equal to or less than 2 mm for printed wiring board and equivalent constructions, where the clearance and the creepage distance are identical and are along the surface of solid insulation, such as the paths described in example 1, example 5 and example 11 of 4.2 of Part 1. The dimensioning is more precise than that provided by Part 1 (i.e IEC 60664-1). This standard can only be used as an entirety. It is not permitted to select one or more clauses from this standard and to use them in place of the corresponding clauses of Part 1. When this standard is applied to the dimensioning of clearances and creepage distances, all clauses shall be used in place of the corresponding clauses given in Part 1. For clearances and creepage distances larger than 2 mm and for solid insulation in general, Part 1 applies. This standard is based on the following criteria for dimensioning: - minimum clearances independent of the micro-environment (see Table 2); - minimum creepage distances for pollution degrees 1, 2 and 3 to avoid failure due to tracking (see Table 4); - minimum creepage distances to avoid flashover across the insulating surface (see Table 5). A test method is specified for allocating unclassified insulating material to the relevant water adsorption group. Has the status of a basic safety publication in accordance with IEC Guide 104.