IEC 60738-1-3:2008
Current
The latest, up-to-date edition.
Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French, Spanish, Castilian
13-02-2008
FOREWORD
INTRODUCTION
1 General data
2 Inspection requirements
IEC 60738-1-3:2008 is a supplementary document to the generic specification and contains requirements for style and layout and minimum content of detail specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of IEC 60738-1:2006,1.4 shall be taken into account. This edition contains changes with respect to the referenced subclauses of the revised Generic Specification IEC 60738-1.
This publication is to be read in conjunction with IEC 60738-1:2009.
Committee |
TC 40
|
DevelopmentNote |
To be read in conjunction with IEC 60738-1. (02/2008) Stability Date: 2021. (10/2012) A Bilingual edition has been published on 28/01/2014. (01/2014)
|
DocumentType |
Standard
|
Pages |
13
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
NF EN 60738-1-3 : 2014 | Identical |
NEN EN IEC 60738-1-3 : 2008 | Identical |
I.S. EN 60738-1-3:2008 | Identical |
UNE-EN 60738-1-3:2008 | Identical |
BS EN 60738-1-3:2008 | Identical |
CEI EN 60738-1-3 : 2009 | Identical |
EN 60738-1-3:2008 | Identical |
DIN EN 60738-1-3:2008-12 | Identical |
SAC GB/T 7154.3 : 2003 | Identical |
PN EN 60738-1-3 : 2008 | Identical |
IEC 60738-1:2006+AMD1:2009 CSV | Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
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