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IEC 60749-15:2003

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-09-2022

Language(s)

English - French

Published date

07-02-2003

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Committee
TC 47
DocumentType
Standard
Pages
11
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 60749-15:2003 Identical
BS EN 60749-15:2003 Identical

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