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Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Amendment of: IEC 60749-20:2002
Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users
Superseded date: 12-09-2022
Language(s): English - French
Published date: 13-08-2003
Publisher: International Electrotechnical Committee
Modification of the validity date: now put at 2007.
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