IEC 60749-20:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
31-08-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
- incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
- inclusion of new Clause 3;
- inclusion of explanatory notes.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-8727-9
|
| Pages |
55
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| OVE EN IEC 60749-20:2023 08 01 | Identical |
| EN IEC 60749-20:2020 | Identical |
| I.S. EN IEC 60749-20:2020 | Identical |
| PN-EN IEC 60749-20:2021-06 | Identical |
| CEI EN IEC 60749-20:2020 | Identical |
| NF EN IEC 60749-20:2020 | Identical |
| UNE-EN IEC 60749-20:2020 | Identical |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.