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  • IEC 60749-20:2020

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  31-08-2020

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

    IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition:
    - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition );
    - inclusion of new Clause 3;
    - inclusion of explanatory notes.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes
    View more information

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