IEC 60749-21:2004
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English, English - French
15-03-2004
Important note : Users cannot be edited or removed once added to your Multi user PDF.Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 60749-21:2011 | Identical |
| UNE-EN 60749-21:2005 | Identical |
| BS EN 60749-21:2005 | Identical |
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