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IEC 61076-5:2001

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Connectors for use in d.c., low-frequency analogue and digital high-speed data applications - Part 5: In-line sockets with assessed quality - Sectional specification

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English - French

Published date

22-03-2001

FOREWORD
1 Scope and object
2 General
  2.1 Normative references
  2.2 Marking
  2.3 Information to be given in a detail specification
  2.4 Standard values
  2.5 Classification
      2.5.1 Termination types
      2.5.2 Contact style
      2.5.3 Insulator body configuration
      2.5.4 Decoupling capacitor
3 Quality assessment procedures
  3.1 General
  3.2 Primary stage of manufacturing
  3.3 Structurally similar sockets
  3.4 Lot-by-lot inspection tests
  3.5 Periodic inspection tests
  3.6 Alternative test methods
4 Test methods and procedures
  4.1 General aspects
  4.2 Pre-conditioning
  4.3 Mounting of specimens
5 Supplementary test information
  5.1 Test conditions
  5.2 Mechanical tests
      5.2.1 Mating force for all socket sizes (insertion
             and withdrawal forces)
      5.2.2 Mechanical operation
      5.2.3 Contact retention
      5.2.4 Vibration
      5.2.5 Mechanical shock
      5.2.6 Terminal strength (robustness of terminations)
      5.2.7 Solder wicking (under consideration)
  5.3 Electrical tests
      5.3.1 Insulation resistance
      5.3.2 Voltage proof
      5.3.3 Contact resistance - Millivolt level method
      5.3.4 Capacitance
      5.3.5 Inductance (under consideration)
  5.4 Environmental tests
      5.4.1 Solderability
      5.4.2 Resistance to soldering heat
      5.4.3 Damp heat
      5.4.4 Dry heat
      5.4.5 Rapid change of temperature (thermal shock)
      5.4.6 Corrosive atmosphere or mixed flowing gas
             or harsh environment (gas tightness)
      5.4.7 Mould growth (fungus)
      5.4.8 Porosity (under consideration)
      5.4.9 Examination of dimensions and mass
      5.4.10 Visual examination
6 Packaging requirements
  6.1 Unit packing
7 Test schedule
  7.1 General
      7.1.1 Basic (minimum) test schedule
      7.1.2 Full test schedule
Annex A (informative) Terminology
Annex B (normative) Test method for determination of
        gas-tight characteristics for electrical
        connectors, sockets and/or contact systems

Defines functional levels, standard test methods and gauges for use in the examination of sockets designed for in-line electronic packages. Lays down appropriate reference dimensions of the mating device and board layout to establish intermateability and interchangeability criteria. Lays down test severity and performance requirements.

DevelopmentNote
Also numbered as BS EN 61076-5 (11/2001)
DocumentType
Standard
Pages
61
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
NEN EN IEC 61076-5 : 2001 Identical
NF EN 61076-5 : 2002 Identical
EN 61076-5 : 2001 Identical
DIN EN 61076-5:2002-04 Identical
I.S. EN 61076-5:2002 Identical
UNE-EN 61076-5:2001 Identical
PN EN 61076-5 : 2002 Identical

BS EN 61076-1:2006 Connectors for electronic equipment. Product requirements Generic specification
EN 61076-1:2006 Connectors for electronic equipment - Product requirements - Part 1: Generic specification
CEI EN 61076-1 : 2007 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 1: GENERIC SPECIFICATION
I.S. EN 61076-1:2006/A1:2019 CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 1: GENERIC SPECIFICATION
IEC 61076-1:2006 Connectors for electronic equipment - Product requirements - Part 1: Generic specification

IEC 60352-3:1993 Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance
IEC 60512-8:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations
IEC 60352-6:1997 Solderless connections - Part 6: Insulation piercing connections - General requirements, test methods and practical guidance
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60512-6:1984 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
IEC 60512-11-8:1995 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 8: Test 11h - Sand and dust
IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
IEC 60512-11-14:2003 Connectors for electronic equipment - Tests and measurements - Part 11-14: Climatic tests - Test 11p: Flowing single gas corrosion test
IEC 60352-1:1997 Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance
IEC 60410:1973 Sampling plans and procedures for inspection by attributes
ISO 1302:2002 Geometrical Product Specifications (GPS) Indication of surface texture in technical product documentation
IEC 60352-5:2012 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
IEC 60512-1-100:2012 Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications
IEC 60512-11-1:1995 Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 1: Test 11a - Climatic sequence
IEC 60512-11-7:2003 Connectors for electronic equipment - Tests and measurements - Part 11-7: Climatic tests - Test 11g: Flowing mixed gas corrosion test
IEC 60512-4:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
IEC 60512-9:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests
IEC 60352-2:2006+AMD1:2013 CSV Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance
IEC 60512-5:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests

€244.32
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