IEC 61189-2-804:2023
Current
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Available format(s)
Hardcopy , PDF
Language(s)
English - French
Published date
25-08-2023
Publisher
€20.57
Excluding VAT
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| DS/EN IEC 61189-2-804:2023 | Identical |
| OVE EN IEC 61189-2-804:2024 11 01 | Identical |
| CEI EN IEC 61189-2-804:2024 | Identical |
| PN-EN IEC 61189-2-804:2024-05 | Identical |
| BS EN IEC 61189-2-804:2023 | Identical |
| UNE-EN IEC 61189-2-804:2023 | Identical |
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