Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

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Hardcopy , PDF

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English - French

Published date

25-08-2023

Publisher

International Electrotechnical Committee

€20.57

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IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.

Committee	TC 91
DocumentType	Standard
Pages	16
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
UNE-EN IEC 61189-2-804:2023	Equivalent
I.S. EN IEC 61189-2-804:2023	Equivalent
BS EN IEC 61189-2-804:2023	Equivalent
DS/EN IEC 61189-2-804:2023	Identical
CEI EN IEC 61189-2-804:2024	Identical
PN-EN IEC 61189-2-804:2024-05	Identical
BS EN IEC 61189-2-804:2023	Identical
UNE-EN IEC 61189-2-804:2023	Identical

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IEC 61189-2-804:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

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