IEC 61190-1-2:2002
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Available format(s)
Hardcopy , PDF
Language(s)
English - French
Published date
22-03-2002
Publisher
Superseded date
31-12-2021
Superseded by
€118.25
Excluding VAT
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| DocumentType |
Standard
|
| Pages |
35
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CEI EN 61190-1-2:2003-05 | Identical |
| UNE-EN 61190-1-2:2002 | Identical |
| BS EN 61190-1-2:2002 | Identical |
Summarise
Important note : Users cannot be edited or removed once added to your Multi user PDF.