IEC 61190-1-2:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Hardcopy , PDF
English, English - French
26-04-2007
31-12-2021
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| UNE-EN 61190-1-2:2007 | Identical |
| BS EN 61190-1-2:2007 | Identical |
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