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  • IEC 61190-1-3:2007/AMD1:2010

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  12-09-2022

    Language(s):  English - French

    Published date:  10-06-2010

    Publisher:  International Electrotechnical Committee

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    Committee TC 91
    Document Type Amendment
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
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