IEC 61191-2:2013
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English - French
05-06-2013
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IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition:
- IPC-A-610 on workmanship has been included as a normative reference;
- some of the terminology used in the document has been updated;
- references to IEC standards have been corrected;
- the use of lead-free solder paste and plating are addressed.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
53
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| UNE-EN 61191-2:2013 | Identical |
| BS EN 61191-2:2013 | Identical |
| PNE-FprEN 61191-2 | Identical |
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