• IEC 61193-3:2013

    Current The latest, up-to-date edition.

    Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  24-01-2013

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Sampling methodologies
    5 Classification of attributes
    6 Defects and process deviation indicator
       (PDI) evaluation
    7 Inspection plans
    8 Classification of defects
    9 Percent defectives per million opportunities
    10 Use of sampling plans
    Annex A (informative) - Example of consensus sampling
            plan for three levels of conformance to requirements
            of IEC 62326-4 multilayer printed boards
    Annex B (informative) - Example of consensus sampling plan
    Annex C (informative) - Operating characteristics curves
            and values
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    BS EN 61191-4:2017 (published 2017-11) Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1 : 2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-1:2001 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    ISO 3951-1:2013 Sampling procedures for inspection by variables Part 1: Specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection for a single quality characteristic and a single AQL
    ISO 2859-4:2002 Sampling procedures for inspection by attributes Part 4: Procedures for assessment of declared quality levels
    ISO 2859-3:2005 Sampling procedures for inspection by attributes Part 3: Skip-lot sampling procedures
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    ISO 2859-2:1985 Sampling procedures for inspection by attributes Part 2: Sampling plans indexed by limiting quality (LQ) for isolated lot inspection
    IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
    IEC 60068-2-38:2009 ENVIRONMENTAL TESTING - PART 2-38: TESTS - TEST Z/AD: COMPOSITE TEMPERATURE/HUMIDITY CYCLIC TEST
    ISO 14560:2004 Acceptance sampling procedures by attributes Specified quality levels in nonconforming items per million
    ISO 21247:2005 Combined accept-zero sampling systems and process control procedures for product acceptance
    ISO 8422:2006 Sequential sampling plans for inspection by attributes
    IEC 60068-2-3:1969 ENVIRONMENTAL TESTING - TEST CA: DAMP HEAT, STEADY STATE
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    ISO 8423:2008 Sequential sampling plans for inspection by variables for percent nonconforming (known standard deviation)
    ISO 2859-10:2006 Sampling procedures for inspection by attributes Part 10: Introduction to the ISO 2859 series of standards for sampling for inspection by attributes
    ISO 14001:2015 Environmental management systems Requirements with guidance for use
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 13448-1:2005 Acceptance sampling procedures based on the allocation of priorities principle (APP) Part 1: Guidelines for the APP approach
    ISO 13448-2:2004 Acceptance sampling procedures based on the allocation of priorities principle (APP) Part 2: Coordinated single sampling plans for acceptance sampling by attributes
    ISO 3951-3:2007 Sampling procedures for inspection by variables Part 3: Double sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection
    ISO 18414:2006 Acceptance sampling procedures by attributes Accept-zero sampling system based on credit principle for controlling outgoing quality
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    ISO 11014:2009 Safety data sheet for chemical products Content and order of sections
    ISO 9000:2015 Quality management systems Fundamentals and vocabulary
    IEC 61249-2-34:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-34: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - NON-HALOGENATED MODIFIED OR UNMODIFIED RESIN SYSTEM, WOVEN E-GLASS LAMINATE SHEETS OF DEFINED RELATIVE PERMITTIVITY (EQUAL TO OR LESS THAN 3,7 AT 1 GHZ) AND FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    ISO 24153:2009 Random sampling and randomization procedures
    ISO 3951-5:2006 Sampling procedures for inspection by variables Part 5: Sequential sampling plans indexed by acceptance quality limit (AQL) for inspection by variables (known standard deviation)
    ISO 2859-5:2005 Sampling procedures for inspection by attributes Part 5: System of sequential sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    ISO 3951-2:2013 Sampling procedures for inspection by variables Part 2: General specification for single sampling plans indexed by acceptance quality limit (AQL) for lot-by-lot inspection of independent quality characteristics
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