IEC 61760-2:2021
Current
The latest, up-to-date edition.
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
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English - French
16-07-2021
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IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
29
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| OVE EN IEC 61760-2:2022 10 01 | Identical |
| I.S. EN IEC 61760-2:2021 | Identical |
| BS EN IEC 61760-2:2021 | Identical |
| EN IEC 61760-2:2021 | Identical |
| CEI EN IEC 61760-2:2022 | Identical |
| PN-EN IEC 61760-2:2022-04 | Identical |
| JIS C 61760-2:2023 | Identical |
| UNE-EN IEC 61760-2:2021 | Identical |
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