IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV
Current
The latest, up-to-date edition.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Hardcopy , PDF
English
18-06-2026
IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
- revision of the figures to match the notation of the drawings of IEC 61240:2016;
- addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
| Committee |
TC 49
|
| DocumentType |
Standard
|
| Pages |
228
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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