IEC 61837-2:2018+AMD1:2020 CSV
Current
The latest, up-to-date edition.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
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24-09-2020
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IEC 61837-2:2018+A1:2020 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
This consolidated version consists of the third edition (2018) and its amendment 1 (2020). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 49
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-8915-0
|
| Pages |
240
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 61837-2:2018/A1:2020 | Identical |
| DS/EN IEC 61837-2:2018/A1:2020 | Identical |
| CEI EN IEC 61837-2/A1 : 2021 | Identical |
| OVE EN IEC 61837-2:2021 07 01 | Identical |
| PN-EN IEC 61837-2:2018-09/A1:2021-06 | Identical |
| EN 61837-2:2011/A1:2014 | Identical |
| I.S. EN IEC 61837-2:2018/A1:2020 | Identical |
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