IEC 62047-15:2015
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
05-03-2015
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing method
Bibliography
IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.
| DevelopmentNote |
Stability date: 2017. (03/2015)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
International Electrotechnical Committee
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| Status |
Withdrawn
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| Standards | Relationship |
| NF EN 62047-15 : 2015 | Identical |
| NBN EN 62047-15 : 2015 | Identical |
| NEN EN IEC 62047-15 : 2015 | Identical |
| PN EN 62047-15 : 2015 | Identical |
| BS EN 62047-15:2015 | Identical |
| CEI EN 62047-15 : 2016 | Identical |
| EN 62047-15:2015 | Identical |
| DIN EN 62047-15:2016-01 | Identical |
| UNE-EN 62047-15:2015 | Identical |
| PNE-FprEN 62047-15 | Identical |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
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