IEC 62148-19:2019
Current
Current
The latest, up-to-date edition.
Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
Available format(s)
Hardcopy , PDF
Language(s)
English - French
Published date
02-05-2019
Publisher
€267.36
Excluding VAT
IEC 62148-19: 2019 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers.
Keywords: physical interface for photonic chip scale packages
| Committee |
TC 86/SC 86C
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-6869-8
|
| Pages |
78
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| OVE EN IEC 62148-19:2020 08 01 | Identical |
| DIN EN IEC 62148-19:2020-07 | Identical |
| EN IEC 62148-19:2019 | Identical |
| NEN-EN-IEC 62148-19:2019 | Identical |
| BS EN IEC 62148-19:2019 | Identical |
| I.S. EN IEC 62148-19:2019 | Identical |
| CEI EN IEC 62148-19 : 2019 | Identical |
| NF EN IEC 62148-19:2019 | Identical |
| UNE-EN IEC 62148-19:2019 | Identical |
| CEI EN IEC 62148-21 : 2019 | Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2019)<br> |
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