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IEC 62148-21:2019

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English - French

Published date

11-03-2019

Superseded date

12-09-2022

€82.26
Excluding VAT

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

Committee
TC 86/SC 86C
DocumentType
Standard
ISBN
978-2-8322-6636-6
Pages
25
ProductNote
THIS STANDARD ALSO REFERS TO IEC TR 61931,IEC 62148-191
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

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€82.26
Excluding VAT