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IEC 62258-1:2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Semiconductor die products - Part 1: Requirements for procurement and use

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Superseded by

IEC 62258-1:2009

Language(s)

English

Published date

30-08-2005

€244.32
Excluding VAT

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including- wafers- singulated bare die- die and wafers with attached connection structures- minimally or partially encapsulated die and wafersThis standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

Committee
TC 47
DocumentType
Standard
Pages
39
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 62258-1:2005 Identical

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