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IEC 62258-2:2005

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Semiconductor die products - Part 2: Exchange data formats

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Superseded by

IEC 62258-2:2011

Language(s)

English, English - French

Published date

13-06-2005

€358.68
Excluding VAT

IEC 62258-2:2005 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the IEC 62258 series as well as definitions of all parameters used according to the principles and methods of IEC 61360-1, IEC 61360-2 and IEC 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Committee
TC 47
DocumentType
Standard
Pages
66
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 62258-2:2011 Identical
UNE-EN 62258-2:2005 Identical

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