IEC 62769-1:2023
Current
The latest, up-to-date edition.
Field Device Integration (FDI®) - Part 1: Overview
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
04-04-2023
IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
Committee |
TC 65/SC 65E
|
DocumentType |
Standard
|
Pages |
59
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
DS/EN IEC 62769-1:2023 | Identical |
PN-EN IEC 62769-1:2024-01 | Identical |
CEI EN IEC 62769-1:2023 | Identical |
UNE-EN IEC 62769-1:2023 | Identical |
CEI EN IEC 62769-109-1:2023 | Field Device Integration (FDI®) Profiles - HART® and Wireless HART® |
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