IEC 62769-101-1:2023
Current
The latest, up-to-date edition.
Field device Integration (FDI)® - Part 101-1: Profiles - Foundation Fieldbus H1
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
14-04-2023
IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2].
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
Committee |
TC 65/SC 65E
|
DocumentType |
Standard
|
Pages |
64
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
DS/EN IEC 62769-101-1:2023 | Identical |
PN-EN IEC 62769-101-1:2024-01 | Identical |
CEI EN IEC 62769-101-1:2023 | Identical |
UNE-EN IEC 62769-101-1:2023 | Identical |
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