IEC 62769-103-1:2020 RLV
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
28-04-2020
Publisher
Superseded date
17-04-2023
Superseded by
€454.51
Excluding VAT
IEC 62769-103-1:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62769-103-1:2020 specifies an FDI profile of IEC 62769 for IEC 61784 1_CP 3/1 (PROFIBUS DP) and IEC 61784 1_CP3/2 (PROFIBUS PA). This second edition cancels and replaces the first edition published in 2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system under a single development tool.
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system under a single development tool.
| Committee |
TC 65/SC 65E
|
| DocumentType |
Redline
|
| ISBN |
978-2-8322-8290-8
|
| Pages |
94
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Summarise
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