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IEC 62769-103-4:2023 RLV

Current

Current

The latest, up-to-date edition.

Field Device Integration (FDI)® - Part 103-4: PROFINET

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

18-04-2023

IEC 62769-103-4:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.







IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]).







[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.







[2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Committee
TC 65/SC 65E
DocumentType
Redline
Pages
111
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

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