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IEC 62769-3:2023

Current

Current

The latest, up-to-date edition.

Field Device Integration (FDI®) - Part 3: Server

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

04-04-2023

€358.68
Excluding VAT

IEC 62769-3:2023 specifies the FDI®[1] Server. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. Annex A provides a functional description of the FDI® Server.

[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Committee
TC 65/SC 65E
DocumentType
Standard
Pages
124
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
DS/EN IEC 62769-3:2023 Identical
CEI EN IEC 62769-3:2023 Identical
PN-EN IEC 62769-3:2024-01 Identical
UNE-EN IEC 62769-3:2023 Identical

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