IEC 62769-7:2023 RLV
Current
The latest, up-to-date edition.
Field Device Integration (FDI®) - Part 7: Communication Devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
06-04-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.
IEC 62769-7:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.
IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI® Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
| Committee |
TC 65/SC 65E
|
| DocumentType |
Redline
|
| Pages |
197
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
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