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IEC 62769-8:2023

Current

Current

The latest, up-to-date edition.

Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-04-2023

IEC 62769-8:2023 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.

Committee
TC 65/SC 65E
DocumentType
Standard
Pages
105
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
DS/EN IEC 62769-8:2023 Identical
CEI EN IEC 62769-8:2023 Identical
PN-EN IEC 62769-8:2024-01 Identical
UNE-EN IEC 62769-8:2023 Identical

CEI EN IEC 62769-109-1:2023 Field Device Integration (FDI®) Profiles - HART® and Wireless HART®

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€316.81
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