IEC 62878-1-1:2015
Current
The latest, up-to-date edition.
Device embedded substrate - Part 1-1: Generic specification - Test methods
Hardcopy , PDF
English - French
20-05-2015
IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
109
|
| ProductNote |
THIS STANDARD ALSO REFERS J-STD 033, JPCA-EB01,IPC 7092.
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 62878-1-1:2015 | Identical |
| BS EN 62878-1-1:2015 | Identical |
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