IEC 62899-301-2:2017
Current
The latest, up-to-date edition.
Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension
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English
30-08-2017
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Coordinate system
5 1-D qualification features
6 2-D qualification features
7 Cross-sectional qualification features
8 Registration accuracy
Bibliography
IEC 62899-301-2:2017(E) defines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate masters.
General critical dimensions are defined to evaluate the shape accuracy of features on the plate master. To evaluate the registration accuracy of features on the plate master, the specification for the registration mark for the plate master is specified. Then, common metrology procedures to measure the critical dimensions and the registration accuracy of the plate master are established for device manufacturers, printing master manufacturers and printing master manufacturing equipment vendors. The measurement terms which are measured by agreement between the user and the supplier are measured using the measurement methods given in this document.
| DevelopmentNote |
Stability Date: 2020. (09/2017)
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| DocumentType |
Standard
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| Pages |
26
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| PublisherName |
International Electrotechnical Committee
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| Status |
Current
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| Standards | Relationship |
| NEN IEC 62899-301-2 : 2017 | Identical |
| BS IEC 62899-301-2:2017 | Identical |
| SEMI P48 : 2010(R2016) | SPECIFICATION OF FIDUCIAL MARKS FOR EUV MASK BLANK |
| SEMI P28 : 1996(R2007) | SPECIFICATION FOR OVERLAY-METROLOGY TEST PATTERNS FOR INTEGRATED-CIRCUIT MANUFACTURE |
| SEMI P36 : 2008(R2013) | GUIDE FOR MAGNIFICATION REFERENCE FOR CRITICAL DIMENSION MEASUREMENT SCANNING ELECTRON MICROSCOPES (CD-SEM) |
| SEMI P21 : 1992(R2003) | GUIDELINES FOR PRECISION AND ACCURACY EXPRESSION FOR MASK WRITING EQUIPMENT |
| SEMI P24 : 1994(R2004) | CD METROLOGY PROCEDURES |
| ISO 1:2016 | Geometrical product specifications (GPS) Standard reference temperature for the specification of geometrical and dimensional properties |
| SEMI P6 : 1988(R2007) | SPECIFICATION FOR REGISTRATION MARKS FOR PHOTOMASKS |
| SEMI P18 : 1992(R2004) | SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS |
| SEMI D21 : 2006(R2015) | TERMINOLOGY FOR FPD MASK PATTERN ACCURACY |
| SEMI P19 : 1992(R2007) | SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE |
| SEMI P30 : 1997(R2004) | PRACTICE FOR CATALOG PUBLICATION OF CRITICAL DIMENSION MEASUREMENT SCANNING ELECTRON MICROSCOPES (CD-SEM) |
| SEMI P43 : 2004(R2011) | PHOTOMASK QUALIFICATION TERMINOLOGY |
| SEMI P35 : 2006(R2013) | TERMINOLOGY FOR MICROLITHOGRAPHY METROLOGY |
| SEMI P47 : 2007(R2013) | TEST METHOD FOR EVALUATION OF LINE-EDGE ROUGHNESS AND LINEWIDTH ROUGHNESS |
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