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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users
Superseded date: 08-11-2011
Language(s): English
Published date: 13-11-2008
Publisher: International Electrotechnical Committee
FOREWORDINTRODUCTION1 Scope2 Normative references3 Terms and definitions4 Procedure of selecting the applicable test method 4.1 Stress to solder joints in the field and test methods 4.2 Selection of test methods based on the shapes and terminals of electronic components5 Common subjects in each test method 5.1 Mounting device and materials used 5.2 Soldering condition 5.3 Accelerated endurance test 5.4 Selection of test conditions and analysis of test results6 Test method 6.1 Body strength test of SMD before and after the rapid temperature change test 6.2 Cyclic bending strength test 6.3 Mechanical shear fatigue test 6.4 Cyclic drop test 6.5 Strength test of leaded component 6.6 Fillet lifting phenomenon observation of leaded componentAnnex A (informative) Condition of rapid temperature change testAnnex B (informative) Soldered joint test by electrical conductionAnnex C (informative) Torque shear strength testAnnex D (informative) Monotonic bending strength testAnnex E (informative) Cyclic steel ball drop strength testAnnex F (informative) Pull strength testAnnex G (informative) Creep strength testAnnex H (informative) Fillet lifting phenomenon observation of leaded component solder joint and the life test by electrical conduction
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
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