IEC PAS 62173:2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Solderability test method
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
15-03-2004
English
22-08-2000
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Purpose
2 Apparatus
2.1 Solder pot
2.2 Dipping device
2.3 Optical equipment
2.4 Steam aging equipment
2.5 Lighting equipment
2.6 Materials
2.7 SMD reflow equipment
3 Procedure for simulated board mounting reflow
solderability test in SMDs
3.1 Test equipment set-up
3.2 Specimen preparation and surface condition
3.3 Visual inspection
4 Procedure for dip and look solderability testing
4.1 Preconditioning
4.2 Solder dip conditions
4.3 Testing
5 Summary
Figures
Tables
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
| DocumentType |
Miscellaneous Product
|
| Pages |
17
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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