IEC PAS 62174:2000
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Resistance to soldering temperature for through-hole mounted devices
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
22-08-2000
Publisher
Superseded date
07-02-2003
Superseded by
€20.57
Excluding VAT
FOREWORD
1 Purpose
2 Apparatus
3 Materials
4 Procedure
5 Summary
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
| DocumentType |
Miscellaneous Product
|
| Pages |
5
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
Summarise
Important note : Users cannot be edited or removed once added to your Multi user PDF.