IEC PAS 62174:2000
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Resistance to soldering temperature for through-hole mounted devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
07-02-2003
English
22-08-2000
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Purpose
2 Apparatus
3 Materials
4 Procedure
5 Summary
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
| DocumentType |
Miscellaneous Product
|
| Pages |
5
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
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