IEC PAS 62213:2001

1 SCOPE
   1.1 Purpose
   1.2 Classification
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 National Conference of Standards Laboratories
        (NCSL)
   2.3 TAPPI (Technical Association Pulp & Paper
        Industry)
   2.4 International Standards
   2.5 Japanese Industrial Standards (JIS)
3 REQUIREMENTS
   3.1 Terms and Definitions
        3.1.1 Para-Aramid Fiber
        3.1.2 Binder
        3.1.3 Bagginess
        3.1.4 Caliper Variation
        3.1.5 Conducting Particles
        3.1.6 Edge Tear/Damaged Roll Edge
        3.1.7 Dents
        3.1.8 Foreign Material
        3.1.9 Wrinkles/Folds
        3.1.10 Holes/Thin Spots
        3.1.11 Poor Formation
        3.1.12 Bundles
        3.1.13 Soft Roll/Telescoping
        3.1.14 Weight Variation
        3.1.15 Crease
        3.1.17 Tears
        3.1.18 Splice
        3.1.19 HighSpots
   3.2 Physical Requirements
        3.2.1 Product
        3.2.2 Filament Diameter
   3.3 Visual Requirements
        3.3.1 Visual/Appearance Procedures
        3.3.2 Visual/Appearance Defects
        3.3.3 Contamination Requirements
   3.4 Dimensional Requirements
        3.4.1 Roll Length
        3.4.2 Roll Width
   3.5 Electrical Requirements
   3.6 Chemical Requirements
4 QUALITY ASSURANCE
   4.1 Responsibility for Inspection
        4.1.1 Test Equipment and Inspection Facilities
        4.1.2 Standard Laboratory Conditions
   4.2 Preparation of Samples
   4.3 Inspection Procedure
        4.3.1 Classification of Major and Minor Visual
               Defects
        4.3.2 Sampling Plans
        4.3.3 Contamination Inspection
   4.4 Acceptability Quality Level (AQL)
   4.5 Statistical Process Control (SPC)
5 PREPARATION FOR DELIVERY
   5.1 Roll Size
        5.1.1 Roll Length
        5.1.2 Roll Width
   5.2 Splices
   5.3 Preservation and Packaging
   5.4 Packing
   5.5 Labeling
6 NOTES
   6.1 Ordering Data
   6.2 New Reinforcements
Specification sheets

Covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications. Determines the nomenclature, definitions, general comments, and physical requirements for reinforcement made from nonwoven para-aramid fibres.