IEC PAS 62240:2001

INTRODUCTION
1. SCOPE
2. REFERENCES
   2.1 NORMATIVE REFERENCES
   2.2 INFORMATIVE REFERENCES
3. TERMS AND DEFINITION
4. OBJECTIVES
5. USING DEVICES OUTSIDE THE MANUFACTURER'S SPECIFIED
   TEMPERATURE RANGES
   5.1 DEVICE SELECTION, USAGE AND ALTERNATIVES
   5.2 DEVICE CAPABILITY ASSESSMENT
   5.3 DEVICE QUALITY ASSURANCE IN WIDER TEMPERATURE RANGES
   5.4 DOCUMENTATION
   5.5 DEVICE IDENTIFICATION
ANNEX A. DEVICE PARAMETER RE-CHARACTERIZATION
   A.1 GLOSSARY OF SYMBOLS
   A.2 RATIONALE FOR PARAMETER RE-CHARACTERIZATION
   A.3 CAPABILITY ASSURANCE
   A.4 QUALITY ASSURANCE
   A.5 FACTORS TO BE CONSIDERED IN PARAMETER RE-CHARACTERIZATION
   A.6 REFERENCES
ANNEX B - STRESS BALANCING
   B.1 INTRODUCTION
   B.2 GLOSSARY OF SYMBOLS
   B.3 STRESS BALANCING
   B.4 APPLICATION EXAMPLE
   B.5 OTHER NOTES
ANNEX C: PARAMETER CONFORMANCE ASSESSMENT
   C.1 INTRODUCTION
   C.2 TEST PLAN
ANNEX D - HIGHER ASSEMBLY LEVEL TESTING
   D.1 INTRODUCTION
   D.2 PROCESS

It lays down processes for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. It is applicable to any designer or manufacturer of equipment intended to operate under conditions that require semiconductor devices to function in temperature ranges beyond those for which the devices are marketed.