IEC PAS 62293:2001

1 SCOPE
   1.1 Purpose
   1.2 Performance Classification
   1.3 Slash Sheet Categories
   1.4 Documentation Hierarchy
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
3 REQUIREMENTS
   3.1 General
        3.1.1 Terms and Definitions
   3.2 Materials
        3.2.1 Rigid Laminates
        3.2.2 Flexible Films
        3.2.3 Bonding Materials
        3.2.4 Other Dielectric and Conductive Materials
        3.2.5 Metal Foils
        3.2.6 Metallic Plating and Coatings
        3.2.7 Solder Resist
        3.2.8 Marking Inks
        3.2.9 Hole Fill Material
   3.3 Visual Examination
        3.3.1 Edges
        3.3.2 Surface Dielectric Imperfections
        3.3.3 Lifted Lands
        3.3.4 Marking
        3.3.5 Solderability
        3.3.6 Adhesion
        3.3.7 Workmanship
   3.4 Dimensional Requirements
        3.4.1 Hole Pattern Accuracy
        3.4.2 Registration (Internal)
        3.4.3 Annular Ring (External)
        3.4.4 Bow and Twist
   3.5 Conductor Definition
        3.5.1 Conductor Width
        3.5.2 Conductor Spacing
        3.5.3 Conductive Surfaces
   3.6 Structural Integrity
        3.6.1 Thermal Stress Method
        3.6.2 Microsection Technique
        3.6.3 Microvia Integrity (after Thermal Stress)
        3.6.4 Filled Vias
        3.6.5 Lifted Lands
   3.7 Other Tests
        3.7.1 Bond Strength, Unsupported Hole or Surface
               Mount Land
   3.8 Solder Resist (Solder Mask) Requirements
        3.8.1 Solder Resist Coverage
   3.9 Electrical Properties
        3.9.1 Circuitry
        3.9.2 Dielectric Withstanding Voltage
        3.9.3 Insulation Resistance
   3.10 Environmental
        3.10.1 Moisture and Insulation Resistance
        3.10.2 Thermal Shock
        3.10.3 Cleanliness
   3.11 Special Requirements
        3.11.1 Outgassing
        3.11.2 Organic Contamination
        3.11.3 Fungus Resistance
        3.11.4 Vibration
        3.11.5 Mechanical Shock
        3.11.6 Impedance Testing
   3.12 Repair
4 QUALITY ASSURANCE
   4.1 General
        4.1.1 Inspection for Delivery
        4.1.2 Referee Tests
Appendix A
Figures
Tables

Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.