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IEC PAS 62293:2001

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English

Published date

28-11-2001

€311.90
Excluding VAT

1 SCOPE
   1.1 Purpose
   1.2 Performance Classification
   1.3 Slash Sheet Categories
   1.4 Documentation Hierarchy
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
3 REQUIREMENTS
   3.1 General
        3.1.1 Terms and Definitions
   3.2 Materials
        3.2.1 Rigid Laminates
        3.2.2 Flexible Films
        3.2.3 Bonding Materials
        3.2.4 Other Dielectric and Conductive Materials
        3.2.5 Metal Foils
        3.2.6 Metallic Plating and Coatings
        3.2.7 Solder Resist
        3.2.8 Marking Inks
        3.2.9 Hole Fill Material
   3.3 Visual Examination
        3.3.1 Edges
        3.3.2 Surface Dielectric Imperfections
        3.3.3 Lifted Lands
        3.3.4 Marking
        3.3.5 Solderability
        3.3.6 Adhesion
        3.3.7 Workmanship
   3.4 Dimensional Requirements
        3.4.1 Hole Pattern Accuracy
        3.4.2 Registration (Internal)
        3.4.3 Annular Ring (External)
        3.4.4 Bow and Twist
   3.5 Conductor Definition
        3.5.1 Conductor Width
        3.5.2 Conductor Spacing
        3.5.3 Conductive Surfaces
   3.6 Structural Integrity
        3.6.1 Thermal Stress Method
        3.6.2 Microsection Technique
        3.6.3 Microvia Integrity (after Thermal Stress)
        3.6.4 Filled Vias
        3.6.5 Lifted Lands
   3.7 Other Tests
        3.7.1 Bond Strength, Unsupported Hole or Surface
               Mount Land
   3.8 Solder Resist (Solder Mask) Requirements
        3.8.1 Solder Resist Coverage
   3.9 Electrical Properties
        3.9.1 Circuitry
        3.9.2 Dielectric Withstanding Voltage
        3.9.3 Insulation Resistance
   3.10 Environmental
        3.10.1 Moisture and Insulation Resistance
        3.10.2 Thermal Shock
        3.10.3 Cleanliness
   3.11 Special Requirements
        3.11.1 Outgassing
        3.11.2 Organic Contamination
        3.11.3 Fungus Resistance
        3.11.4 Vibration
        3.11.5 Mechanical Shock
        3.11.6 Impedance Testing
   3.12 Repair
4 QUALITY ASSURANCE
   4.1 General
        4.1.1 Inspection for Delivery
        4.1.2 Referee Tests
Appendix A
Figures
Tables

Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.

DocumentType
Miscellaneous Product
Pages
60
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
NEN NPR IEC/PAS 62293 : 2002 Identical
BIS IS 15479 : 2004 Identical

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 7721 : 1998 REPAIR AND MODIFICATION OF PRINTED BOARDS AND ELECTRONIC ASSEMBLIES
IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
IPC AI 642 : 1988 USER'S GUIDELINES FOR AUTOMATED INSPECTION OF ARTWORK, INTERLAYERS AND UNPOPULATED PWBS
IPC 6018 : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
IPC 2226 : 0 SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC PC 1990 : 1990 GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC FC 232 : C1994 AMD 1 1995 ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS
IPC FC 231 : C1992 AMD 1 1995 FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING
IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC FC 241 : C1992 AMD 1 1995 FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING
IPC ET 652 : 1990 GUIDELINES AND REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
IPC 6015 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES
IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS

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