IEC PAS 62588:2008

1 SCOPE
  1.1 Purpose
2 REFERENCE DOCUMENTS
  2.1 IPC
  2.2 JEDEC
  2.3 IEC
  2.4 European Parliament
  2.5 ANSI
3 TERMS AND DEFINITIONS
  3.1 2D Code Label (Matrix)
  3.2 2 Li (or 2LI)
  3.3 2[nd] Level Interconnect
  3.4 2[nd] Level Interconnect Component Label
  3.5 2[nd] Level Interconnect Terminal Finish or Material
  3.6 Component
  3.7 Base Materials
  3.8 Halogen-Free Board
  3.9 Homogeneous Material
  3.10 intct (or INTCT)
  3.11 Linear Bar Code Label
  3.12 Material Category
  3.13 Maximum Component Temperature
  3.14 'Pb-Free'
  3.15 Pb-Free Symbol
4 SYMBOLS, LABELS AND MARKS
  4.1 Material Category Symbol
       4.1.1 Size and Location
       4.1.2 Color
       4.1.3 Font
  4.2 Pb-Free Symbol
  4.3 2[nd] Level Interconnect Component Label
       4.3.1 Size
       4.3.2 Color
5 MARKING/LABELING CATEGORIES
  5.1 PCB Base Material Categories
       5.1.1 Halogen-Free Base Material
  5.2 PCB Surface Finish Categories
       5.2.1 Pb-Containing
       5.2.2 Pb-Free
  5.3 2[nd] Level Interconnect Categories
       5.3.1 Pb-Containing
       5.3.2 Pb-Free
  5.4 Conformal Coating Categories
6 COMPONENT MARKING AND LABELING
  6.1 Component Marking
  6.2 Lowest Level Shipping Container Labeling
7 PCB/ASSEMBLY MARKING AND LABELING
  7.1 PCB Marking
       7.1.1 PCB Shipping Container Labeling
  7.2 Assembly Marking
       7.2.1 Assembly Shipping Container Labeling
  7.3 Solder Category Marking Sequence
  7.4 Location
  7.5 Size
  7.6 Color
  7.7 Font
  7.8 Method
  7.9 Marking Sequence
  7.10 Re-Marking Changes in PCBA Materials
8 MARKING AND/OR LABELING OF LEAD (Pb)-CONTAINING COMPONENTS,
  8.1 Marking and Labeling of Components
  8.2 Marking and Labeling of PCBs
  8.3 Marking and Labeling of PCB Assemblies
9 SUMMARY OF MARKING AND LABELING REQUIREMENTS
Annex A - Acknowledgment

IEC/PAS 62588:2008(E) applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach.IEC/PAS 62588:2008(E) also applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This document applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).