IEC TR 60068-3-12:2007
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
12-03-2007
Publisher
Superseded date
12-09-2022
Superseded by
€82.26
Excluding VAT
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
| Committee |
TC 91
|
| DocumentType |
Technical Report
|
| Pages |
16
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| BS EN 60966-4:2003 | Identical |
| PD IEC/TR 60068-3-12:2007 | Identical |
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