IEC TR 62240:2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
23-04-2013
English
22-06-2005
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Objectives
5 Using devices outside the manufacturer's specified
temperature ranges
5.1 Device selection, usage and alternatives
5.2 Device capability assessment
5.3 Device quality assurance in wider temperature ranges
5.4 Documentation
5.5 Device identification
Annex A (informative) Device parameter re-characterisation
A.1 Glossary of Symbols
A.2 Rationale for parameter re-characterisation
A.3 Capability assurance
A.4 Quality assurance
A.5 Factors to be considered in parameter re-characterisation
A.6 References
Annex B (informative) Stress balancing
B.1 General
B.2 Glossary of symbols
B.3 Stress balancing
B.4 Application example
B.5 Other notes
Annex C (informative) Parameter conformance assessment
C.1 General
C.2 Test plan
Annex D (informative) Higher assembly level testing
D.1 General
D.2 Process
Bibliography
Reports processes that exist for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. Covers applications in avionics in which only the performance of the device is an issue. The wider temperature ranges will be limited to those that do not compromise the system performance or application-specific reliability of the device.
DevelopmentNote |
Supersedes IEC PAS 62240 (06/2005) Stability Date: 2013. (10/2012)
|
DocumentType |
Technical Report
|
Pages |
52
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
PKN IEC/TR 62240 : 2007 | Identical |
NEN NPR IEC/TR 62240 : 2005 | Identical |
PD IEC/TR 62240:2005 | Identical |
DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
IEC 60134:1961 | Rating systems for electronic tubes and valves and analogous semiconductor devices |
IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
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