IEC TR 62878-2-7:2019
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English
20-03-2019
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
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